Tag Archive for 'SD&A 2011'
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Judit Martinez Bauza1, Manish P. Shiralkar2, Vikas Ramachandra (Presenter)
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1Qualcomm Inc. (United States) 2Clemson Univ. (United States)
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Michael J. Sykora
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3M Co. (United States)
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L. Azzari1, F. Battisti2, A. Gotchev1, M. Carli2, K. Egiazarian1,
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1Tampere University of Technology, Tampere (Finland), 2Universita’ degli Studi Roma TRE, Rome (Italy)
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Takanori Yokoi1, Tomohiro Yendo1, Mehrdad Panahpour Tehrani1, Toshiaki Fujii2, Masayuki Tanimoto1
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1Nagoya Univ. (Japan) 2Tokyo Institute of Technology (Japan)
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Jung-Hun Jung, Byoung-Sub Song, Sung-Wook Min
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Kyung Hee Univ. (Korea, Republic of)
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BongHo Lee
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Electronics and Telecommunications Research Institute (Korea, Republic of)
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Paul Kerbiriou, Guillaume Boisson, Korian Sidibe
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Technicolor R & D France (France)
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Ramesh Raskar
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Associate Professor, MIT Media Lab
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Roger Olsson, Håkan Andersson, Mårten Sjöström
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Mid Sweden Univ. (Sweden)
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Takehiro Yamada, Toshiaki Fujii
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Tokyo Institute of Technology (Japan)
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Andrew J. Woods
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Curtin Univ. of Technology (Australia)
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Atanas R. Boev, Robert Bregovic, Atanas P. Gotchev
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Tampere Univ. of Technology (Finland)
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Michael A. Weissman1, Andrew J. Woods2
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1TrueVision Systems (United States), 2Curtin Univ. of Technology (Australia)
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Benjamin Battin, Cédric Niquin, Philippe Vautrot1, Didier G. Debons2, Laurent Lucas3
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1 Univ. de Reims Champagne-Ardenne (France), 23DTV Solutions (France), 3Univ. de Reims Champagne-Ardenne (France)
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Pierre M. Boher, Thierry R. Leroux, Veronique Collomb-Patton
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ELDIM (France)
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Volker Kuchelmeister
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The Univ. of New South Wales (Australia)
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Inna Tsirlin, Robert S. Allison, Laurie M. Wilcox
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York Univ. (Canada)
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Christopher D. Riemann M.D.
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Cincinnati Eye Institute and MedNet Technologies, Inc. (United States)
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Hiroyasu Ujike, Hiroshi Watanabe
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National Institute of Advanced Industrial Science and Technology (Japan)
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Lenny Lipton
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Oculus3D (United States)
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Kevin J. MacKenzie, Ruth Dickson, Simon J. Watt
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Bangor Univ. (United Kingdom)
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Frederic Devernay, Sylvain Duchêne, Adrian Ramos-Peon
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INRIA Rhône-Alpes (France)
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Kenneth M. Jacobs1, Ronald S. Karpf2
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1Binghamton Univ. (United States), 2ADDIS Inc. (United States)
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Maurice van Beurden, Wijnand Ijsselsteijn
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Technische Univ. Eindhoven (Netherlands)
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Liyuan Xing1, Junyong You1, Touradj Ebrahimi2, Andrew Perkis1
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1Norwegian Univ. of Science and Technology (Norway), 2Ecole Polytechnique Fédérale de Lausanne (Switzerland)
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Takashi Shibata1, Joohwan Kim, David M. Hoffman, Martin S. Banks2
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1Univ. of California, Berkeley (United States) and Waseda Univ. (Japan), 2Univ. of California, Berkeley (United States)
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Melinos Averkiou, Neil A. Dodgson
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Univ. of Cambridge (United Kingdom)
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Hosik Sohn, Seong-il Lee, Yong Man Ro, Hyun Wook Park
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Korea Advanced Institute of Science and Technology (Republic of Korea)
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Shunnan Yang
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Pacific Univ. (United States)
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Valter Drazic, Jean-Jacques Sacré, Jérôme Bertrand, Arno Schubert
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Technicolor (France)
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Hao Pan, Chang Yuan, Scott Daly
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Sharp Labs. of America, Inc. (United States)
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Lenny Lipton (Panel Moderator)
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CTO, Oculus 3D
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Mikko Kytö, Jussi Hakala, Pirkko Oittinen
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Aalto Univ. School of Science and Technology (Finland)
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Amy Turner, Nicolas S. Holliman
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Durham Univ. (United Kingdom)
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Huynh-Thu Quan, Luca Schiatti
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Technicolor (France)
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Bernard Mendiburu (Panel Moderator)
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Author, 3D Movie Making
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Ulrich Leiner
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Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
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Masahiko Ogawa, Kazunori Shidoji
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Kyushu Univ. (Japan)
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Brian R. Gardner
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Independent 3D Consultant (United States)
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Michael G Robinson
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Chief Scientist, RealD
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Junle Wang, Marcus Barkowsky, Vincent Ricordel, Patrick Le Callet
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Univ. de Nantes (France)
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Felix Raimbault, Anil Kokaram
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Trinity College Dublin (Ireland)
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